FPC技术手册.ppt
FPC LAYOUT 技術手冊,1.FPC产品系列应用介绍 1.1 NOTEBOOK 1.2 LCD PANEL 1.3 PDA 1.4 CELLULAR PHONE2.原材料介紹 2.1 铜箔 2.2 Coverlay 2.3 Stiffener 2.4 相关测试规范3.FPC 标准制程流程介绍 3.1 单面板/双面板 3.2 单面板双层做法 3.3 缕空板 4.制程能力介绍,目录,Application For Nootbook,Hinge CableDouble-sided FPCImpedance 50 5 60,000 Cycles Flexure LifeEMI Strategy Application,Hinge CableDouble-sided FPCImpedance 50 5 60,000 Cycles Flexure Life,CardbusDouble-sided FPC100 MHz Transfer Speed,Touch PadDouble-sided FPCSMT Mounting,Application For Nootbook CD/DVD ROM,Double-sided FPCStandard IDE InterfaceGrounding Strategy Application,Single-sided FPCSpindle Control UnitSwitch&Photo Sensor Applied on FPC,Single-sided FPC60,000 Cycles Flexure LifeUltra Thin Material Design,Application For Lcd Panel,LCM CableDouble-sided FPCSMC MountingEMI Noise Depression,LCM CableDouble-sided FPCSMC MountingACF Laminating on FPC,LCM CableDouble-sided FPCFine Pattern(L/S=1.6/1.8 mil)ACF Laminating on FPC,Application For PDA,Switch BoardDouble-sided FPCSMT Mounting,Battery BoardSingle-sided FPC SMC MountingHigh Current-carriyng Capacity,Application For CELLULAR PHONE,Double-sided FPC100,000 Cycles Flexure LifeACF Laminating on FPC,Double-sided FPCBattery,Raw Material-CCL,相關名詞:Copper Clad Laminates(銅薄基材)Single-Sided(單面銅薄基材)Double-Sided(雙面銅薄基材)Copper Foil:銅箔，銅皮RA 銅:壓延銅箔,輾壓方式。ED 銅:電解銅箔,電鍍方式(Electrodeposited)。一盎司:即在一平方英呎的面積上，長出一盎司的銅。Polyimide(PI)聚亞醯胺:是一種由Bismaleimide與Aromatic Diamine所共同聚合而成的優良樹脂,杜邦公司將之做成片材，稱為Ketpon。,Coverlay(覆蓋膜):是由介質薄膜與背膠層所組成，用於動態軟板時，須注意軟板線路層與覆膜兩者之平衡。,Raw Material-CVL,Raw Material Manufacturing Process,用途:材質區分:PI/PET/FR4/SUS結合方式:PSA:感壓型 Thermal Set:熱固型 Thermal Plastic:熱塑型,Raw Material-STIFFENER,FPC材料所用的相关测试,IPCTM650JIS标准,FPC的可靠性测试,一、剥离强度二、耐热性三、可焊性四、耐化学溶剂五、弯曲疲劳,Manufacturing Process,Coverlay,Adhesive,Copper,Adhesive,Base Film,Adhesive,Copper,Adhesive,Coverlay,鑽孔NC Drilling,雙面板Double Sided,黑孔&鍍銅Black Hole&Cu Plating,CVL壓合CVL Lamination,沖孔Hole Punching,沖型Blanking,電測/目檢Elec.-test&Visual Inspection,表面黏著/組裝SMT&Assembly,壓膜/曝光D/F Lamination&Exposure,顯影/蝕刻/去膜D.E.S.,單面板SingleSided,自動光學檢測Automatic OpticalInspection,假貼合CVL Lay up,錫鉛電鍍/噴鍚Sn/Pb Platingor HAL,電測/目檢Elec.-test&Visual Inspection,印刷Screen Printing,制程能力介绍,一、板厚单面：最小：0.068mm普通：0.135mm双面：最小：0.16mm普通：0.275mm,制程能力介绍,二、最小线宽线距单面：1/2ozCu：0.05mm0.05mm1ozCu：0.075mm0.075mm双面：1/3ozCu：0.05mm0.05mm1/2ozCu：0.075mm0.075mm,制程能力介绍,三、最小过孔最小过孔：0.2mm最小过孔焊盘：0.5mm,制程能力介绍,四、线到板边最小距离0.25mm,s,s,s,s,制程能力介绍,五、焊盘开窗最小单边比焊盘大0.1mm焊盘开窗到邻近线的距离最小为0.1mm,制程能力介绍,六、模具公差刀模：0.2mm普通钢模：0.1mm精密钢模：0.05mm,制程能力介绍,七、冲模最小冲孔圆孔：0.4mm方孔：0.4mm 0.4mm长方孔：0.3mm 0.6mm,制程能力介绍,八、模具间隙最小0.4mm九、模具搭边最小1mm,c,The End,
