欧盟芯片法案中英文对照全套.docx

欧盟芯片法案中英文对照全套REGULATIONOFTHEEUROPEANPARLIAMENTANDOFTHECOUNCILestablishingaframeworkofmeasuresforstrengtheningEurope'ssemiconductorecosystem（ChipsAct）2022版欧洲议会和理事会建立加强欧洲半导体生态系统的措施框架的规定（芯片法案）（中英文对照完整版）TABLEOFCONTENTS总目录CHAPTERIGENERALPROVISIONS第一章一般规定Article1Subjectmatter第一条主题第二条定义CHAPTERIICHIPSFOREUROPEINITIATIVE第二章欧洲行动的芯片SECTION1GENERALPROVISIONS第一节一般规定Article 3 EstablishmentoftheInitiative第三条行动的建立Article 4 ObjectivesoftheInitiative第四条行动的目标Article 5 ComponentsoftheInitiative第五条行动的组成Article 6 SynergieswithUnionprogrammes第六条与欧盟方案的协同作用第7条欧洲芯片基础设施共同体Article 8 Europeannetworkofcompetencecentresinsemiconductors第8条欧洲半导体产能中心网络Article 9 Implementation第九条实施行动CHAPTERIIISECURITYOFSUPPLY第三章供应安全Article 10 IntegratedProductionFacilities第十条综合生产设施Article 11 OpenEUFoundries第十一条开放的欧盟生产基地Article 12 Applicationandrecognition第十二条申请和认可Article 13 Publicinterestandpublicsupport第十三条公共利益和公众支持Article 14 Nationalfast-trackingofpermitgrantingprocedures第十四条国家快速跟踪许可证审批程序CHAPTERIVMONITORINGANDCRISISRESPONSE第四章监控和危机应对SECTION1MONITORING第一节监测Article 15 Monitoringandalerting第十五条监测和预警Article 16 Unionriskassessmentandearlywarningindicators第十六条欧盟风险评估和预警指标第十七条主要市场行为者SECTION2SEMICONDUCTORSUPPLYCRISISSTAGE第二节半导体供应危机阶段Article 18 Activationofthecrisisstage第十八条应对危机阶段Article 19 Emergencytoolbox第十九条应急工具箱Article 20 Informationgathering第二十条信息收集Article 21 Priorityratedorders第二十一条优先级订单Article 22 Commonpurchasing第二十二条共同购买CHAPTERVGOVERNANCE第五章管理SECTION 1 EUROPEANSEMICONDUCTORBOARD第一节欧洲半导体委员会Article 23 EstablishmentandtasksoftheEuropeanSemiconductorBoard第23条欧洲半导体委员会的设立和任务Article 24 StructureoftheEuropeanSemiconductorBoard第24条欧洲半导体委员会的结构Article 25 OperationoftheEuropeanSemiconductorBoard第25条欧洲半导体委员会的运作SECTION 2 NATIONALCOMPETENTAUTHORITIES第二节国家行政机关Article 26 Designationofnationalcompetentauthoritiesandsinglepointsofcontact第二十六条指定国家主管当局和单一联络点第六章保密和处罚Article 27 Treatmentofconfidentialinformation第二十七条保密信息的处理Article 28 PenaltiesandfinesArticle 29 第二十八条处罚和罚款Article 30 1.imitationperiodfortheimpositionoffinesandperiodicpenaltypaymentsArticle 31 第二十九条罚款和定期支付罚款的期限Article 32 1.imitationperiodfortheenforcementofpenalties第三十条处罚的实施时效Article 33 Righttobeheardfortheimpositionoffinesorperiodicpenaltypayments第三十一条对处以罚款或定期支付罚款的申诉权CHAPTERVIIDELEGATIONOFPOWERANDCOMMITTEEPROCEDURE第七章授权与委员会程序Article 34 Exerciseofthedelegation第三十二条授权的行使Article 35 Committee第33条半导体委员会CHAPTERVIIIFINALPROVISIONS第八章最终条款Article 34 AmendmentstoRegulation(EU)2021/694establishingtheDigitalEuropeProgrammeandrepealingDecision(EU)2015/2240第34条建立数字欧洲行动的条例(欧盟)2021/694修正案和废除决定(欧盟)2015/2240Article 35 Evaluationandreview第35条评估和审查Article 36 Entryintoforce第三十六条法案生效部分章节示例如下：CHAPTERIICHIPSFOREUROPEINITIATIVE第二章涉及欧洲行动的芯片Article 3 EstablishmentoftheInitiative第三条行动的建立1. TheInitiativeisestablishedforthedurationoftheMultiannualFinancialFramework2021-2027.2. TheInitiativeshallbesupportedbyfundingfromtheHorizonEuropeprogrammeandtheDigitalEuropeprogramme,andinparticularSpecificObjective6thereof,foramaximumindicativeamountofEUR1.65billionandEUR1.65billionrespectively.ThisfundingshallbeimplementedinaccordancewithRegulation(EU)No2021/695andRegulation(EU)No2021/694.L该行动是在2021-2027年多年期财政框架期间设立的。2该行动应得到地平线欧洲行动和数字欧洲行动，特别是具体目标6的资助，最高指标金额分别为16.5亿欧锯口16.5亿欧元。该资金应按照(EU)第2021/695号法规和(EU)第2021/694号法规实施。Article 4 ObjectivesoftheInitiative第四条行动的目标ThegeneralobjectiveoftheInitiativeistosupportlarge-scaletechnologicalcapacitybuildingandinnovationthroughouttheUniontoenabledevelopmentanddeploymentofcutting-edgeandnextgenerationsemiconductorandquantumtechnologiesthatwillreinforcetheUnionadvanceddesign,systemsintegrationandchipsproductioncapabilities,aswellascontributetotheachievementofthetwindigitalandgreentransition.行动的总体目标是支持大规模的技术能力建设和创新在整个欧盟使开发和部署的前沿和下T弋半导体和量子技术，将加强欧盟先进设计、系统集成和芯片生产能力，以及有助于实现双数字和绿色过渡。Article 6 SynergieswithUnionprogrammes第六条与欧盟方案的协同作用1. TheInitiativeshallenablesynergieswithUnionprogrammes,asreferredtoinAnnexIII.TheCommissionshallensurethattheachievementoftheobjectivesisnothamperedwhenleveragingthecomplementarycharacteroftheInitiativewithUnionprogrammes.该行动应使与附件三所规定的欧盟方案产生协同作用。委员会应确保在利用该行动与欧洲欧盟方案的补充性质时，不妨碍这些目标的实现。Article 7 EuropeanChipsInfrastructureConsortium第7条欧洲芯片基础设施共同体1. ForthepurposeofimplementingeligibleactionsandotherrelatedtasksfundedundertheInitiativeaEuropeanChipsInfrastructureConsortium(zECICz)maybeestablishedundertheconditionssetoutinthisArticle.1.为了实施合格的行动和根据该行动资助的其他相关任务，可以在本法规定的条件下建立一个欧洲芯片基础设施共同体(''ECIU)o2. TheECICshall2.共同体应(a) havelegalpersonalityfromthedateofentryintoforceoftheCommissiondecisionreferredtoinparagraph6;(b) haveoneormorestatutoryseats,whichshallbelocatedontheterritoryofoneormoreMemberStates;(c) consistofatleastthreelegalentitiesfromatleastthreeMemberStatesandbeoperatedasapublic-privatesectorconsortiumwiththeparticipationoftheMemberStates,andprivatelegalentities;(d) appointthecoordinator.(a)自第6段所规定的委员会决定生效之日起具有法人资格；(b)拥有一个或多个法定席位，它们应位于一个或多个成员国的领土上;(C)由至少三个成员国的至少三个法人实体组成，并作为公私营部门联合体和私营法人实体参与运作；(d)任命协调员。(b)enhancingexistinganddevelopingnewadvancedpilotlines.Thisoperationalobjectiveshallbeachievedthrough:(1) strengtheningtechnologicalcapabilitiesinnextgenerationchipsproductiontechnologies,byintegratingresearchandinnovationactivitiesandpreparingthedevelopmentoffuturetechnologynodes,includingleading-edgenodesbelowtwonanometres,FullyDepletedSilicononInsulator(FD-SOI)at10nanometresandbelowzand3Dheterogeneoussystemsintegrationandadvancedpackaging;(b)加强现有和发展新的先进试点线路。该操作目标应通过以下方式来实现：Q)加强下一代芯片生产技术的技术能力，通过整合研究和创新活动，准备未来技术节点的发展，包括2纳米以下的前沿节点，10纳米及以下的绝缘子上完全耗尽硅(FD-SOl),3D异质系统集成和先进封装；(2) supportinglargescaleinnovationthroughaccesstoneworexistingpilotlinesforexperimentation,test,andvalidationofnewdesignconceptsintegratingkeyfunctionalities,suchasnovelmaterialsandarchitecturesforpowerelectronicsfosteringsustainableenergyandelectromobility,lowerenergyconsumption,security,higherlevelsofcomputingperformanceorintegratingbreakthroughtechnologiessuchasneuromorphicandembeddedartificialintelligence(AI)chips,integratedphotonics,grapheneandother2Dmaterialbasedtechnologies;(2)支持大规模创新通过访问新的或现有的试点线路实验、测试和验证的新设计概念集成关键功能，如新材料和架构电力电子促进可持续的能源和电子迁移，低能源消耗、安全、更高水平的计算性能或集成突破性技术，如神经形态和嵌入式人工智能(AI)芯片、集成光子学、石墨烯和其他基于2D材料的技术；Article8Europeannetworkofcompetencecentresinsemiconductors第8条欧洲半导体产能中心网络1. ForthepurposeofimplementingactionsundertheInitiative/scomponentreferredtoinArticle5,point(d)zaEuropeannetworkofcompetencecentresinsemiconductors(the'network')maybeestablished.1.为了实施根据第5条第(d)点所规定的的行动组成部分采取的行动，可以建立一个欧洲半导体产能中心网络(网络"2. WithrespecttotheimplementationofactionsundertheInitiative'scomponentreferredtoinArticleS1point(d),thenetworkmayperformallorsomeofthefollowingactivitiestothebenefitoftheUnionindustry,inparticularSMEsandmid-capszaswellasthepublicsector:(a)providingaccesstodesignservicesanddesigntoolsundertheInitiative'scomponentreferredtoinArticle5zpoint(a),aswellastothepilotlinessupportedundertheInitiative*scomponentreferredtoinArticle5zpoint(b);2.关于实施第5条第(d)点所规定的的行动组成部分下的行动，该网络可实施下列全部或部分活动，以有利于欧盟行业，特别是中小型企业和中小型企业以及公共部门：(a)提供第5条第点所规定的行动的组成部分下的设计服务和设计工具以及第5条第(b)点所规定的行动的组成部分下支持的试点线路；Article11OpenEUFoundries第十一条开放的欧盟生产基地OpenEUFoundriesarefirst-of-a-kindsemiconductorfront-endorback-end,orbothzmanufacturingfacilitiesintheUnionthatofferproductioncapacitytounrelatedundertakingsandtherebycontributetothesecurityofsupplyfortheinternalmarket.1.开放的欧盟生产基地是欧盟中第一个半导体前端或后端，或两者的制造设施，为不相关的企业提供生产能力，从而有助于内部市场的供应安全。1. AnOpenEUFoundryshallmeetthefollowingcriteria:2.开放欧盟生产基地应符合以下标准：(a) itqualifiesasafirst-of-a-kindfacility;(b) itsestablishmentandoperationhaveaclearpositiveimpactontheUnion'ssemiconductorvaluechainwithregardtoensuringthesecurityofsupplyandincreasingqualifiedworkforce,takingintoaccountinparticulartheextenttowhichitoffersfront-endorback-endzorboth,productioncapacitytoundertakingsnotrelatedtothefacility,ifthereissufficientdemand;(a)其为一流的设施；(b)建立和操作有明确的积极影响欧盟的半导体价值链关于确保供应安全和增加合格的劳动力，特别是考虑到它提供的前端或后端,或两者,生产能力事业无关的设施，如果有足够的需求；(c) itguaranteesnottobesubjecttotheextraterritorialapplicationofpublicserviceobligationsofthirdcountriesinawaythatmayunderminetheundertaking'sabilitytocomplywiththeobligationssetoutinArticle21(1)andcommitstoinformtheCommissionwhensuchobligationarises;(d) itcommitstoinvestinthenextgenerationofchips.(C)保证不受第三国的域外适用公共服务义务的方式可能损害企业的能力遵守义务第21条(1)并承诺等义务出现时通知委员会；(d)该公司承诺投资于下一代芯片。Article16Unionriskassessmentandearlywarningindicators第十六条欧盟风险评估和预警指标1. TheCommissionshall,afterconsultingtheEuropeanSemiconductorBoard,assessrisksthatmaydisrupt,compromiseornegativelyaffectthesupplyofsemiconductors(Unionriskassessment).IntheUnionriskassessment,theCommissionshallidentifyearlywarningindicators.2. TheCommissionshallreviewtheUnionriskassessmentincludingtheearlywarningindicatorsasnecessary.3. WhenmonitoringthesemiconductorvaluechainpursuanttoArticle15zMemberStatesshallmonitortheearlywarningindicatorsidentifiedbytheCommission.1 .欧盟委员会应在咨询欧洲半导体委员会后，评估可能扰乱、损害或对半导体供应产生负面影响的风险（欧盟风险评估）。在欧盟风险评估中，欧盟委员会应确定早期预警指标。2 .委员会应审查欧盟的风险评估，必要时包括早期预警指标。3 .在根据第15条监测半导体价值链时，成员国应监测委员会确定的早期预警指标。